IEC 62878-2-602:2021
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
| Edition date: |
2021-06-22
In Force
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|---|---|
| Available languages: | English, French |
| Summary: | IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules. L'IEC 62878-2-602:2021 spécifie les exigences et les méthodes d’évaluation de la connectivité électrique. Il s’applique aux empilements de modules électroniques. |
| ICS: | 31.190-Electronic component assemblies, 31.180-Printed circuits and boards |
| CTN: | TC 91 - 1286 |
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Otras Relaciones |
Acuerdo de Frankfurt prEN IEC 62878-2-602:2020 |










