IEC 61190-1-3:2007/AMD1:2010
Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
| Edition date: |
2017-12-13
Cancelled
|
|---|---|
| Available languages: | English, French |
| ICS: | 31.190-Electronic component assemblies |
| CTN: | TC 91 - 1286 |
|
Standards Cancellations |
Es anulada por IEC 61190-1-3:2017 |
|
Modificaciones Normas |
Modifica a IEC 61190-1-3:2007 |










