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IEC
IEC 62047-9:2011/COR1:2012
En Vigor
2012-03-08
Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices
- Part 9: Wafer to wafer bonding strength measurement for MEMS
IEC
IEC 62769-100:2023 RLV
En Vigor
2023-04-11
Field device integration (FDI®) - Part 100: Profiles - Generic protocols
IEC
IEC 60684-3-280:2019 RLV
En Vigor
2019-08-20
Flexible insulating sleeving - Part 3: Specifications for individual
types of sleeving - Sheet 280: Heat-shrinkable, polyolefin sleeving, anti-tracking
IEC
IEC 61049:1991/COR1:1992
En Vigor
1992-01-01
Corrigendum 1 - Capacitors for use in tubular fluorescent and other
discharge lamp circuits. Performance requirements
IEC
IEC 62933-2-1:2017/COR1:2019
En Vigor
2019-01-08
Corrigendum 1 - Electrical energy storage (EES) systems - Part 2-1: Unit
parameters and testing methods - General specification
IEC
IEC 60510-1-3:1980
En Vigor
1980-01-01
Methods of measurement for radio equipment used in satellite earth
stations. Part 1: Measurements common to sub-systems and combinations of
sub-systems. Section Three: Measurements in the i.f. range
IEC
IEC 61629-2:1996
En Vigor
1996-11-14
Aramid pressboard for electrical purposes - Part 2: Methods of test
IEC
IEC 60061-1:1969/AMD50:2014
En Vigor
2014-02-19
Amendment 50 - Lamp caps and holders together with gauges for the
control of interchangeability and safety - Part 1: Lamp caps










