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IEC
IEC 62321-3-1:2013
En Vigor
2013-06-19
Determination of certain substances in electrotechnical products - Part
3-1: Screening - Lead, mercury, cadmium, total chromium and total
bromine by X-ray fluorescence spectrometry
IEC
IEC 61189-2-721:2015
En Vigor
2015-04-29
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 2-721: Test methods for
materials for interconnection structures - Measurement of relative
permittivity and loss tangent for copper clad laminate at microwave
frequency using a split post dielectric resonator
IEC
IEC 60264-3-2:1999
En Vigor
1999-04-28
Packaging of winding wires - Part 3-2: Taper barrelled delivery spools -
Specification for returnable spools made from thermoplastic materials
IEC
IEC 63171-1:2024
En Vigor
2024-04-03
Connectors for electrical and electronic equipment - Part 1: Detail
specification for 2-way, shielded or unshielded, free and fixed
connectors - Mechanical mating information, pin assignment and
additional requirements for Type 1 (copper LC style)
IEC
IEC 61169-44:2012
En Vigor
2012-12-12
Radio-frequency connectors - Part 44: Sectional specification for series
SMP push-on radio-frequency coaxial connectors
IEC
IEC 61754-34:2016
En Vigor
2016-09-26
Fibre optic interconnecting devices and passive components - Fibre optic
connector interfaces - Part 34: Type URM connector family
IEC
IEC 61300-2-15:2008
En Vigor
2008-02-07
Fibre optic interconnecting devices and passive components - Basic test
and measurement procedures - Part 2-15: Tests - Torque strength of
coupling mechanism
IEC
IEC 60191-6-6:2001
En Vigor
2001-03-22
Mechanical standardization of semiconductor devices - Part 6-6: General
rules for the preparation of outline drawings of surface mounted
semiconductor device packages - Design guide for fine pitch land grid
array (FLGA)










