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IEC
IEC 60641-2:2004
In Force
2004-06-23
Pressboard and presspaper for electrical purposes - Part 2: Methods of tests
IEC
IEC 60404-2:1996
In Force
1996-03-28
Magnetic materials - Part 2: Methods of measurement of the
magneticproperties of electrical steel sheet and strip by means of
anEpstein frame
IEC
CISPR 16-2-2:2010
In Force
2010-07-28
Specification for radio disturbance and immunity measuring apparatus and
methods - Part 2-2: Methods of measurement of disturbances and immunity
- Measurement of disturbance power
IEC
IEC 60512-14-2:2006
In Force
2006-03-23
Connectors for electronic equipment - Tests and measurements - Part
14-2: Sealing tests - Test 14b: Sealing - Fine air leakage
IEC
IEC 61079-2:1992
In Force
1992-07-15
Methods of measurement on receivers for satellite broadcasttransmissions
in the 12 GHz band - Part 2: Electrical measurementson DBS tuner units
IEC
IEC 60454-3-11:2007
In Force
2007-05-10
Pressure-sensitive adhesive tapes for electrical purposes - Part 3:
Specifications for individual materials - Sheet 11: Polyester film
combinations with glass filament, creped cellulosic paper, polyester
non-woven, epoxy and pressure-sensitive adhesive
IEC
IEC 60529:1989+AMD1:1999 CSV/COR1:2003
In Force
2003-01-21
Corrigendum 1 - Degrees of protection provided by enclosures (IP Code)
IEC
IEC 60748-23-5:2003
In Force
2003-10-03
Semiconductor devices - Integrated circuits, Part 23-5: Hybrid
integrated circuits and film structures - Manufacturing line
certification - Procedure for qualification approval
IEC
IEC 60297-3-103:2004
In Force
2004-08-17
Mechanical structures for electronic equipment - Dimensions of
mechanical structures of the 482,6 mm (19 in) series - Part 3-103:
Keying and alignment pin
IEC
IEC 60811-405:2012
In Force
2012-03-12
Electric and optical fibre cables - Test methods for non-metallic
materials - Part 405: Miscellaneous tests - Thermal stability test for
PVC insulations and PVC sheaths
IEC
IEC
IEC 61156-1-1:2001
In Force
2001-02-27
Multicore and symmetrical pair/quad cables for digital communications -
Part 1-1: Capability Approval - Generic specification
IEC
IEC 60384-20:2023
In Force
2023-02-03
Fixed capacitors for use in electronic equipment - Part 20: Sectional
specification - Fixed metallized polyphenylene sulfide film dielectric
surface mount DC capacitors
IEC
IEC 60749-1:2002
In Force
2002-08-30
Semiconductor devices - Mechanical and climatic test methods - Part 1: General
IEC
IECQ CS 033200-TW0003:2015
In Force
2015-09-01
IEC Quality Assessment System for Electronic Components (IECQ System) -
Component Specification - Multi Layer Ceramic Capacitor (MLCC): X7R,
Soft termination, 200~250V
IEC
IEC 60811-408:2012
In Force
2012-03-12
Electric and optical fibre cables - Test methods for non-metallic
materials - Part 408: Miscellaneous tests - Long-term stability test of
polyethylene and polypropylene compounds
IEC
IEC 60793-1-34:2021
In Force
2021-02-10
Optical fibres - Part 1-34: Measurement methods and test procedures -
Fibre curl
IEC
IEC 61158-6-20:2014
In Force
2014-08-19
Industrial communication networks - Fieldbus specifications - Part 6-20:
Application layer protocol specification - Type 20 elements
IEC
IECQ OD 3802:2015
In Force
2015-07-08
IEC Quality Assessment System for Electronic Components (IECQ System) -
Operational Document - Quality system requirements for manufacturers
seeking IECQ LED Component Product Certificates of Conformity for
Component Product(s) associated with LED lighting
IEC
IEC 60191-6-2:2001
In Force
2001-12-11
Mechanical standardization of semiconductor devices - Part 6-2: General
rules for the preparation of outline drawings of surface mounted
semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and
1,00 mm pitch ball and column terminal packages










