Saltar navegación principal
Estás en: Home>Normas>Buscador de normas

Para búsqueda de normas ISO, ASTM, IEC, IEEE, BSI, DIN , SAE y EN utilizar términos en inglés

Estado
Idioma
Buscador de normas

Buscador de normas

Resultados para:

Número de resultados: 139

Estado: Active / 2021-03

Connectors for electrical and electronic equipment - Tests and measurements - Part 11-1: Climatic tests - Test 11a - Climatic sequence (IEC 60512-11-1:2019); German version EN IEC 60512-11-1:2019 / Note: DIN EN 60512-11-1 (1999-08) remains valid alongside this standard until 2022-06-20.

Estado: Active / 2017-04

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016

Estado: Active / 2016-12

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 62047-26:2016); German version EN 62047-26:2016

Estado: Active / 2016-12

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2016); German version EN 62047-1:2016 / Note: DIN EN 62047-1 (2006-10) remains valid alongside this standard until 2019-02-10.

Estado: Active / 2015-12

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015); German version EN 62047-16:2015

Estado: Active / 2015-12

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (IEC 62047-17:2015); German version EN 62047-17:2015

Estado: Active / 2015-04

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (IEC 62047-21:2014); German version EN 62047-21:2014

Estado: Active / 2015-04

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014

Estado: Active / 2014-04

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013

Estado: Active / 2014-04

Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (IEC 62047-19:2013); German version EN 62047-19:2013

Estado: Active / 2014-04

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013); German version EN 62047-11:2013

Estado: Active / 2012-10

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012); German version EN 62047-14:2012

Estado: Active / 2012-10

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012); German version EN 62047-13:2012

Estado: Active / 2012-07

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General - Section 4: Test 1d: Contact protection effectiveness (scoop-proof) (IEC 60512-1-4:1997); German version EN 60512-1-4:1997, Corrigendum to DIN EN 60512-1-4:1998-02; (IEC-Cor. :2000 to IEC 60512-1-4:1997)

Estado: Active / 2012-06

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011); German version EN 62047-12:2011

Estado: Active / 2012-03

Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches (IEC 62047-5:2011); German version EN 62047-5:2011

Estado: Active / 2012-03

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011

Estado: Active / 2012-03

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011

Estado: Active / 2012-02

Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (IEC 62047-7:2011); German version EN 62047-7:2011

Estado: Active / 2011-12

Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011); German version EN 62047-8:2011

Estado: Active / 2011-03

Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010

Estado: Active / 2010-07

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010

Estado: Active / 2007-02

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006); German version EN 62047-2:2006

Estado: Active / 2007-02

Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile-testing (IEC 62047-3:2006); German version EN 62047-3:2006

Estado: Active / 2001-11

Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests; Test 12g: Solderability, wetting balance method (IEC 60512-12-7:2001); German version EN 60512-12-7:2001

Estado: Active / 2001-04

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 20-2: Test: 20b: Flammability tests; Fireproofness (IEC 60512-20-2:2000); German version EN 60512-20-2:2000

Estado: Active / 2000-10

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 6: Dynamic stress tests; section 5: Test 6e: Random vibration (IEC 60512-6-5:1997, modified); German version EN 60512-6-5:1999

Estado: Active / 1999-07

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11: Climatic tests; Section 8: Test 11h: Sand and dust (IEC 60512-11-8:1995); German version EN 60512-11-8:1999 / Note: Applies in conjunction with DIN EN 60512-1 (2001-11).

Estado: Active / 1998-03

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 19: Chemical resistance tests; section 3: Test 19c: Fluid resistance (IEC 60512-19-3:1997); German version EN 60512-19-3:1997

Estado: Active / 1998-02

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General examination; Section 3: Test 1c: Electrical engagement length (IEC 60512-1-3:1997); German version EN 60512-1-3:1997

Estado: Active / 1998-02

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General; Section 4: Test 1d: Contact protection effectiveness (scoop-proof) (IEC 60512-1-4:1997); German version EN 60512-1-4:1997

Estado: Active / 1997-05

Transformers and inductors for use in telecommunication and electronic equipment - Main dimensions of coil formers - Part 1: Coil formers for laminated cores (IEC 61797-1:1996); German version EN 61797-1:1996

Estado: Active / 1996-09

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in machine soldering (IEC 60512-12-6:1996); German version EN 60512-12-6:1996

Estado: Tramitación / 2022-11-30

Conectores para equipos eléctricos y electrónicos. Ensayos y mediciones. Parte 99-003: Programas de ensayo de resistencia. Ensayo 99c: Programas de ensayo para conectores simétricos de un solo par que se desacoplan bajo carga eléctrica

Estado: Withdrawn / 2021-03

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11: Climatic tests; Section 1: Test 11a: Climatic sequence (IEC 60512-11-1:1995); German version EN 60512-11-1:1999 / Note: A transition period, as set out in DIN EN IEC 60512-11-1 (2021-03), exists until 2022-06-20.

Estado: Withdrawn / 2021-03

Connectors for electrical and electronic equipment - Tests and measurements - Part 11-1: Climatic tests - Test 11a - Climatic sequence (IEC 60512-11-1:2019); German version EN IEC 60512-11-1:2019 / Note: Date of issue 2019-12-13

Estado: Withdrawn / 2019-02

Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass (IEC 62047-15:2015); German version EN 62047-15:2015

Estado: Withdrawn / 2018-09

Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature (IEC 47F/243/CD:2016) / Note: Date of issue 2016-07-22

Estado: Withdrawn / 2018-09

Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT) (IEC 47F/216/CD:2015) / Note: Date of issue 2015-07-03

Estado: Withdrawn / 2018-07

Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film (IEC 47F/241/CD:2016) / Note: Date of issue 2016-07-22

Estado: Withdrawn / 2017-11

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates (IEC 47/2224/CD:2015) / Note: Date of issue 2015-05-01

Estado: Withdrawn / 2017-04

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 47F/183/CD:2014) / Note: Date of issue 2014-04-18

Estado: Withdrawn / 2016-12

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2005); German version EN 62047-1:2006 / Note: A transition period, as set out in DIN EN 62047-1 (2016-12), exists until 2019-02-10.

Estado: Withdrawn / 2016-12

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 47F/177/CD:2013) / Note: Date of issue 2014-04-25

Estado: Withdrawn / 2016-12

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 47F/178/CD:2013) / Note: Date of issue 2014-04-18

Estado: Withdrawn / 2016-01

Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding quality between PDMS and glass (IEC 47F/126/CD:2012) / Note: Date of issue 2012-11-12

Estado: Withdrawn / 2015-12

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 47F/125/CD:2012) / Note: Date of issue 2012-11-12

Estado: Withdrawn / 2015-12

Semiconductor devices - Micro- electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin film (IEC 47F/78/CD:2011) / Note: Date of issue 2011-06-20

Estado: Withdrawn / 2015-04

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 47F/128/CD:2012) / Note: Date of issue 2012-11-12

Estado: Withdrawn / 2015-04

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (IEC 47F/127/CD:2012) / Note: Date of issue 2012-11-12

Número de resultados: 139

Lo más vendido

Normas
Libros