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Número de resultados: 140
DIN EN IEC 63366:2023-01 DIN
Estado: Active / 2023-01
Product category rules for life cycle assessment of electrical and electronic products and systems (IEC 111/646/CD:2021); Text in German and English / Note: Date of issue 2022-12-09
DIN EN IEC 60512-11-1:2021-03 DIN
Estado: Active / 2021-03
Connectors for electrical and electronic equipment - Tests and measurements - Part 11-1: Climatic tests - Test 11a - Climatic sequence (IEC 60512-11-1:2019); German version EN IEC 60512-11-1:2019 / Note: DIN EN 60512-11-1 (1999-08) remains valid alongside this standard until 2022-06-20.
DIN EN 62047-25:2017-04 DIN
Estado: Active / 2017-04
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
DIN EN 62047-26:2016-12 DIN
Estado: Active / 2016-12
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 62047-26:2016); German version EN 62047-26:2016
DIN EN 62047-1:2016-12 DIN
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2016); German version EN 62047-1:2016 / Note: DIN EN 62047-1 (2006-10) remains valid alongside this standard until 2019-02-10.
DIN EN 62047-16:2015-12 DIN
Estado: Active / 2015-12
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015); German version EN 62047-16:2015
DIN EN 62047-17:2015-12 DIN
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (IEC 62047-17:2015); German version EN 62047-17:2015
DIN EN 62047-21:2015-04 DIN
Estado: Active / 2015-04
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (IEC 62047-21:2014); German version EN 62047-21:2014
DIN EN 62047-22:2015-04 DIN
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014
DIN EN 62047-11:2014-04 DIN
Estado: Active / 2014-04
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013); German version EN 62047-11:2013
DIN EN 62047-18:2014-04 DIN
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013
DIN EN 62047-19:2014-04 DIN
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (IEC 62047-19:2013); German version EN 62047-19:2013
DIN EN 62047-14:2012-10 DIN
Estado: Active / 2012-10
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012); German version EN 62047-14:2012
DIN EN 62047-13:2012-10 DIN
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012); German version EN 62047-13:2012
DIN EN 60512-1-4 Berichtigung 1:2012-07 DIN
Estado: Active / 2012-07
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General - Section 4: Test 1d: Contact protection effectiveness (scoop-proof) (IEC 60512-1-4:1997); German version EN 60512-1-4:1997, Corrigendum to DIN EN 60512-1-4:1998-02; (IEC-Cor. :2000 to IEC 60512-1-4:1997)
DIN EN 62047-12:2012-06 DIN
Estado: Active / 2012-06
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011); German version EN 62047-12:2011
DIN EN 62047-9:2012-03 DIN
Estado: Active / 2012-03
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
DIN EN 62047-10:2012-03 DIN
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011
DIN EN 62047-5:2012-03 DIN
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches (IEC 62047-5:2011); German version EN 62047-5:2011
DIN EN 62047-7:2012-02 DIN
Estado: Active / 2012-02
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (IEC 62047-7:2011); German version EN 62047-7:2011
DIN EN 62047-8:2011-12 DIN
Estado: Active / 2011-12
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011); German version EN 62047-8:2011
DIN EN 62047-4:2011-03 DIN
Estado: Active / 2011-03
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010
DIN EN 62047-6:2010-07 DIN
Estado: Active / 2010-07
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010
DIN EN 62047-2:2007-02 DIN
Estado: Active / 2007-02
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006); German version EN 62047-2:2006
DIN EN 62047-3:2007-02 DIN
Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile-testing (IEC 62047-3:2006); German version EN 62047-3:2006
DIN EN 60512-12-7:2001-11 DIN
Estado: Active / 2001-11
Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests; Test 12g: Solderability, wetting balance method (IEC 60512-12-7:2001); German version EN 60512-12-7:2001
DIN EN 60512-20-2:2001-04 DIN
Estado: Active / 2001-04
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 20-2: Test: 20b: Flammability tests; Fireproofness (IEC 60512-20-2:2000); German version EN 60512-20-2:2000
DIN EN 60512-6-5:2000-10 DIN
Estado: Active / 2000-10
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 6: Dynamic stress tests; section 5: Test 6e: Random vibration (IEC 60512-6-5:1997, modified); German version EN 60512-6-5:1999
DIN EN 60512-11-8:1999-07 DIN
Estado: Active / 1999-07
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11: Climatic tests; Section 8: Test 11h: Sand and dust (IEC 60512-11-8:1995); German version EN 60512-11-8:1999 / Note: Applies in conjunction with DIN EN 60512-1 (2001-11).
DIN EN 60512-19-3:1998-03 DIN
Estado: Active / 1998-03
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 19: Chemical resistance tests; section 3: Test 19c: Fluid resistance (IEC 60512-19-3:1997); German version EN 60512-19-3:1997
DIN EN 60512-1-3:1998-02 DIN
Estado: Active / 1998-02
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General examination; Section 3: Test 1c: Electrical engagement length (IEC 60512-1-3:1997); German version EN 60512-1-3:1997
DIN EN 60512-1-4:1998-02 DIN
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General; Section 4: Test 1d: Contact protection effectiveness (scoop-proof) (IEC 60512-1-4:1997); German version EN 60512-1-4:1997
DIN EN 61797-1:1997-05 DIN
Estado: Active / 1997-05
Transformers and inductors for use in telecommunication and electronic equipment - Main dimensions of coil formers - Part 1: Coil formers for laminated cores (IEC 61797-1:1996); German version EN 61797-1:1996
DIN EN 60512-12-6:1996-09 DIN
Estado: Active / 1996-09
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in machine soldering (IEC 60512-12-6:1996); German version EN 60512-12-6:1996
PNE-prEN IEC 60512-99-003 Proyecto
Estado: Tramitación / 2023-01-11
Conectores para equipos eléctricos y electrónicos. Ensayos y mediciones. Parte 99-003: Programas de ensayo de resistencia. Ensayo 99c: Programas de ensayo para conectores simétricos de un solo par que se desacoplan bajo carga eléctrica
DIN EN 60512-11-1:1999-08 DIN
Estado: Withdrawn / 2021-03
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11: Climatic tests; Section 1: Test 11a: Climatic sequence (IEC 60512-11-1:1995); German version EN 60512-11-1:1999 / Note: A transition period, as set out in DIN EN IEC 60512-11-1 (2021-03), exists until 2022-06-20.
DIN EN IEC 60512-11-1:2020-01 DIN
Connectors for electrical and electronic equipment - Tests and measurements - Part 11-1: Climatic tests - Test 11a - Climatic sequence (IEC 60512-11-1:2019); German version EN IEC 60512-11-1:2019 / Note: Date of issue 2019-12-13
DIN EN 62047-15:2016-01 DIN
Estado: Withdrawn / 2019-02
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass (IEC 62047-15:2015); German version EN 62047-15:2015
DIN EN 62047-29:2016-08 DIN
Estado: Withdrawn / 2018-09
Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature (IEC 47F/243/CD:2016) / Note: Date of issue 2016-07-22
DIN EN 62047-27:2015-08 DIN
Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT) (IEC 47F/216/CD:2015) / Note: Date of issue 2015-07-03
DIN EN 62047-30:2016-08 DIN
Estado: Withdrawn / 2018-07
Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film (IEC 47F/241/CD:2016) / Note: Date of issue 2016-07-22
DIN EN 62951-1:2015-06 DIN
Estado: Withdrawn / 2017-11
Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates (IEC 47/2224/CD:2015) / Note: Date of issue 2015-05-01
DIN EN 62047-25:2014-05 DIN
Estado: Withdrawn / 2017-04
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 47F/183/CD:2014) / Note: Date of issue 2014-04-18
DIN EN 62047-1:2006-10 DIN
Estado: Withdrawn / 2016-12
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2005); German version EN 62047-1:2006 / Note: A transition period, as set out in DIN EN 62047-1 (2016-12), exists until 2019-02-10.
DIN EN 62047-26:2014-05 DIN
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 47F/178/CD:2013) / Note: Date of issue 2014-04-18
DIN EN 62047-1:2014-05 DIN
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 47F/177/CD:2013) / Note: Date of issue 2014-04-25
DIN EN 62047-15:2012-11 DIN
Estado: Withdrawn / 2016-01
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding quality between PDMS and glass (IEC 47F/126/CD:2012) / Note: Date of issue 2012-11-12
DIN EN 62047-17:2011-06 DIN
Estado: Withdrawn / 2015-12
Semiconductor devices - Micro- electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin film (IEC 47F/78/CD:2011) / Note: Date of issue 2011-06-20
DIN EN 62047-16:2012-11 DIN
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 47F/125/CD:2012) / Note: Date of issue 2012-11-12
DIN EN 62047-22:2012-11 DIN
Estado: Withdrawn / 2015-04
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 47F/128/CD:2012) / Note: Date of issue 2012-11-12
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