Resumen:
This International Standard specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates.
Dieses Dokument legt ein Zug-Prüfverfahren fest, mit dem die elektromechanischen Eigenschaften leitfähiger dünner MEMS-Werkstoffe (MEMS; en: micro-electromechanical system), die auf nicht leitfähigen flexiblen Substraten gebondet wurden, zu messen.
Keywords:
Base materials, Components, Conductive, Definitions, Dimensions, Electrical engineering, Electromechanics, Materials, Measurement, Measuring techniques, Mechanical properties, Microelectronics, Microsystem techniques, Properties, Samples, Semiconductor devices, Substrates (coating), System engineering, Tensile testing, Tensile tests, Testing, Testing conditions, Testing system, Thin films, Thin-film devices, Thin-film technology