DIN EN 62047-13:2012-10

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012); German version EN 62047-13:2012

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 13: Méthodes d'essais de types courbure et cisaillement de mesure de la résistance d'adhérence pour les structures MEMS (CEI 62047-13:2012); Version allemande EN 62047-13:2012

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 13: Biege- und Scherprüfverfahren zur Messung der Haftfestigkeit bei MEMS-Strukturen (IEC 62047-13:2012); Deutsche Fassung EN 62047-13:2012

Información:

Fecha:

2012-10 /Active

Idiomas Disponibles:

Alemán

ICS:

31.080.01 - Semiconductor devices in general

31.220.01 - Electromechanical components in general

Equivalencias internacionales:

EN 62047-13 (2012-04)

IEC 62047-13 (2012-02)

Relación con otras normas DIN:

Reemplaza a: DIN IEC 62047-13 (2010-05)

Resumen:

This part of DIN EN 62047 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 µm to 1 mm, respectively.

Keywords:

Adhesive shear strength, Adhesive strength, Bend testing, Bending strength, Definitions, Microelectronics, Microsystem techniques, Semiconductor devices, Shear strength, Shear tests, System engineering, Testing

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