Resumen:
This test method is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.
Dieses Prüfverfahren dient der Bewertung und dem Vergleichen des Verhaltens bei Fallbeanspruchung eines oberflächenmontierbaren Bauelements bei tragbaren elektronischen Geräten (Handhelds) mittels beschleunigender Umgebungsprüfbedingungen, wobei über eine exzessive Durchbiegung der Leiterplatte ein Ausfall des Gerätes verursacht wird.
Keywords:
Climate, Climatic tests, Components, Definitions, Drop tests, Electrical engineering, Electrical measurement, Electronic engineering, Electronic equipment and components, Environmental testing, Error detection, Height of fall, Integrated circuits, Materials, Measurement, Measuring techniques, Mechanical testing, Parameters, Power electronics, Printed-circuit boards, Quality assurance, Reliability, Resistance strain gauges, Semiconductor devices, Semiconductors, SMD, Specimens, Surface mounting, Surface mounting devices, Testing, Testing conditions, Testing devices