DIN EN 61189-5-1:2017-04
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (IEC 61189-5-1:2016); German version EN 61189-5-1:2016
| Edition date: |
2017-04-01
In Force
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|---|---|
| Available languages: | German |
| Summary: | This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. Dieser Teil von IEC 61189 ist ein Katalog von Prüfverfahren, die methodische Verfahren und Prüfabläufe darstellen, die bei der Prüfung bestückter Leiterplatten angewandt werden können. |
| Keywords: | Assemblies|Checking equipment|Corrosion tests|Determination|Electrical components|Electrical engineering|Electronic equipment and components|Equipment|Fluxes (materials)|Guide books|Handbooks|Insulating resistance|Interconnection|Interconnection structures|Mechanical testing|Methods|Precision|Printed circuits|Printed-circuit boards|Procedures|Qualification tests|Soldering pastes|Testing|Testing devices|Viscosity |
| ICS: | 31.180-Printed circuits and boards |
| CTN: | |
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International Equivalence |
Identic EN 61189-5-1:2016 Identic IEC 61189-5-1:2016 |
|
Reemplazo Normas |
Reemplaza a DIN EN 61189-5-1:2014-10 |










