BS EN 60749-40:2011
Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using a strain gauge
| Edition date: |
2011-09-30
In Force
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| Available languages: | English |
| Summary: | This part of IEC 60749 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component. Test method IEC 60749-37 uses an accelerometer to measure the mechanical shock duration and magnitude applied which is proportional to the stress on a given component mounted on a standard board. The detailed specification shall state which test method is to be used.
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| ICS: | |
| CTN: | EPL/47 - EPL/47 |
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International Equivalence |
Identic EN 60384-3:2006 Identic IEC 60749-40:2011 Identic EN 60749-40:2011 |










