NF EN 60191-6-5
Mechanical standardization of semiconductor devices - Part 6-5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
| Edition date: |
2002-08-01
In Force
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|---|---|
| Available languages: | French, English |
| Summary: | Le présent document est un guide de conception pour boîtiers matriciels à billes et à pas fins. |
| Keywords: | ELECTRONIC COMPONENTS|SMD|SEMICONDUCTOR DEVICES|ELECTRICAL CASES|OVERALL DIMENSIONS|PREPARATION|DESIGN|DIMENSIONS|INTERCHANGEABILITY |
| ICS: | 31.080.01-Semiconductor devices in general, 31.020-Electronic components in general |
| CTN: | |
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International Equivalence |
Identic EN 60191-6-5:2001 Identic IEC 60191-6-5:2001 |










